silicon wafer slag

Broken silicon wafer slag belong to one of the five major categories of silicon raw materials (broken silicon wafers, monocrystalline silicon wafers, head and tail materials, pot bottom materials and special materials). Silicon wafer slag (Silicon wafer slag) is the fragments produced by the operators during the serial production process of slicing, degumming, cleaning and logistics of monocrystalline silicon wafers. Silicon wafer is the raw material for making transistors and integrated circuits, and is generally a slice of monocrystalline silicon. Due to the extremely high silicon content of monocrystalline silicon wafers, the silicon content purity of the silicon wafer slag is also very high. It can reach more than 99.99%. Such high-purity silicon wafer slag can be used to reprocess various silicon products, or as silicon additives for metallurgy and chemical industries.



Wafer is the basic material for manufacturing semiconductor chips. The most important raw material for semiconductor integrated circuits is silicon, so the corresponding is silicon wafer. Silicon is widely present in rocks and gravel in the form of silicate or silicon dioxide in nature. The manufacture of silicon wafers can be summarized into three basic steps: silicon refining and purification, single crystal silicon growth, and wafer molding. The by-product in the silicon purification process is silicon slag. The waste in the monocrystalline silicon production process is monocrystalline silicon scrap, and the waste in the wafer molding process is silicon wafer slag, also called broken wafer scraps. These three by-products The silicon content is from low to high.

The current processing method of silicon wafer slag is to re-use electronic-grade silicon wafer slag or broken silicon girts that meet the recycling conditions as raw materials. Before returning to the furnace, it must go through a series of treatments, including repeated manual sorting and piece-by-piece inspection, which can be divided into the following two types of treatment methods: first, the original silicon wafer slag can be processed by cleaning and drying; second According to its processing level, the finished silicon wafer slag will restore its original silicon state through a series of chemical methods, and then return to the furnace to become the raw material for solar-grade silicon wafers.